2106033 – System Integration in Micro- and Nanotechnology I

The lecture will be given in English It deals with technologies and processes for assembling components and systems in small dimensions (meso, micro, nano). The technologies presented are illustrated using concrete components that are passed around during the lecture. Hence, the lecture could also be entitled: “How to assemble small devices” ;-). Part 1 starts with the basics and introduces the first set of processes. Part 2 introduces further processes and applications. Each part of the lecture stands on its own and can be listened to independently of the others. Structure of Part 1 - Introduction to system integration (basics) - Brief introduction to MEMS processes - Solid-state joints - Surfaces and plasma processes for surface treatment - Technical bonding - Assembly and connection technology in electronics - Molded interconnect devices (MID) - Functional printing - Low temperature cofired ceramics in system integration